ODE Isıpan DT-VS - Extruded Polystyrene Thermal Insulation Board
Technical Specifications
| Minimum Thermal Conductivity | 0,028 W/mK |
|---|---|
| Water Vapor Diffusion Resistance Coefficient |
µ=100 |
| Fire Classification TS EN 13501-1 |
B1 |
| Minimum Compression Resistance with a Deformation of 10% |
200 - 500 kPa |
| Surface Structure | Embossed, Plane |
Specifications
- Closed cell.
- Low thermal conductivity coefficient.
- Optimum water vapor diffusion resistance coefficient, which prevents condensation, but allows the building to breathe.
- Cell structure that does not allow water absorption.
- High pressure resistance
- TSE Certificate of Conformity
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